Tag Archives: PowerVia

During the VLSI Symposium in Japan, Intel shared some details on its new 18A process node, which is poised to enter full production in the latter half of 2025. This isn't merely an incremental step; Intel 18A represents a fundamental re-engineering of the silicon foundation, combining Gate-All-Around (GAA) transistors with …

Today Intel is unveiling its latest innovation – PowerVia, a new power delivery method set to debut on the Intel 20A process node in 2024. This marks Intel as the first in the industry to implement backside power delivery on a product-like test chip.  Speaking on PowerVia, Ben Sell, Intel …

Today Intel has revealed its roadmap of process and packaging improvements, which will power the next several generations of Intel CPUs leading up to 2025 and beyond. This includes Intel's first new transistor architecture in more than a decade.