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Memory

From DDR3 to DDR2 to Laptop. Whatever memory you need – check out KitGuru’s opinion before you buy.

Samsung begins mass production of 32-layer 3D V-NAND memory

Samsung Electronics on Thursday said it had begun mass production of its second-generation three-dimensional (3D) V-NAND flash memory. The new memory is projected to be more cost-efficient that the previous-gen 3D V-NAND thanks to higher integration. The company also unveiled its new series of solid-state drives that are based on …

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Toshiba and SanDisk license technologies for next-gen memory

Toshiba Corp. and SanDisk Corp. on Monday announced that they had licensed intellectual property from Intermolecular. The technologies, which were developed under the collaborative development program (CDP) as well as Intermolecular's background intellectual property, are believed to be crucial for next-generation memory. The companies' CDP with Intermolecular, specifically aimed at …

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Rambus joins JEDEC committee to co-develop next-gen server memory

History always repeats itself. Rambus and JEDEC have a history that began in the early nineties and greatly influenced the whole dynamic random access memory (DRAM) industry in the 2000s and 2010s. That history is about to repeat itself. Rambus, a developer of high-speed interfaces and owner of multiple standard-essential …

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Samsung begins to mass produce 3D V-NAND flash in China

Samsung Electronics, one of the world’s top makers of NAND flash memory, last week announced that its new memory fab in Xi’an China has begun full-scale manufacturing operations. The new facility will produce Samsung’s advanced NAND flash memory chips, such as 3D V-NAND. Vertical NAND (V-NAND) memory stacks memory cells …

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Micron expected to hike DRAM prices this month – report

The prices of dynamic random access memory (DRAM) may start to increase this month as two out of three major computer memory makers are experiencing problems with fulfilling market demands. In case the situation with under-supply of DRAM is not resolved, the high prices will remain for several months down …

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Toshiba, SanDisk start mass production of 15nm NAND memory

Toshiba Corp. and SanDisk Corp. on Wednesday said that they would start to produce multi-level cell (MLC) NAND flash memory using 15nm fabrication process later in April. The new manufacturing technology allows Toshiba to make world’s smallest and potentially cost-efficient 128Gb NAND flash memory. Initially, Toshiba and SanDisk will produce …

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Micron Technology promises TLC NAND flash memory in Q4 2014

Micron Technology, one of the world’s leading maker of DRAM and NAND flash memory, said that late this year the company would offer triple-level cell NAND flash made using 16nm process technology. Such memory could enable very cost-efficient flash-based storage devices, including solid-state drives in 2015. “Our 16nm NAND yields …

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Samsung ramps up volume production of DDR4 memory

Samsung Electronics said Tuesday that it had begun mass production of DDR4 memory modules and chips in anticipation of Intel’s launch of next-generation high-end desktop and server platforms that rely on the new-gen memory technology. Samsung’s DDR4 memory modules are based on the company’s 4Gb DDR4 chips produced using 20nm …

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SK Hynix reveals 128GB DDR4 memory module [UPDATED]

UPDATE: The initial news-story contained an image of an SK Hynix memory module which did not feature 128GB capacity. As SK Hynix has released the correct images of its new memory modules, we can now publish the photos of 128GB DDR4 memory sticks. SK Hynix on Monday unveiled the industry’s …

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Samsung begins to produce DRAM using 20nm process technology

Samsung Electronics on Tuesday said that it had begun mass production of dynamic random access memory using 20nm process technology. The new fabrication tech will not only enable the company to produce more energy-efficient DDR3 memory, but will also reduce manufacturing cost of DRAM and will thus make it more …

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Hybrid memory cube 2.0 to offer up to 480GB/s of bandwidth

The hybrid memory cube consortium (HMCC), an organization dedicated to the development and establishment of an industry-standard interface specification for the hybrid memory cube (HMC) technology, this week introduced version 2.0 of the HMC spec. The second generation of the “cubes” will be able to support bandwidth of up to …

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Samsung boosts output of DRAM made using 25nm technology

Samsung Electronics, the world’s No. 1 maker of DRAM, may further improve its market share by boosting output of memory produced using leading-edge manufacturing process, according to industry analysts. The company is reportedly increasing production of dynamic random access memory using 25nm process technology, which is a threat to Micron …

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Innodisk introduces memory modules with special coatings

Innodisk, a leading manufacturer of special-purpose DRAM and NAND flash products, has introduced its new breed of memory modules with conformal coatings applied are protected from moisture, dust and chemical contaminants. Such modules are useful in extreme environments, including industrial, embedded, automate and so on. Innodisk conformal coatings refer to …

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Computer memory prices declined in the first half of January

The contract prices of dynamic random access memory (DRAM) began to decline in January due to increased production at SK Hynix's Wuxi plant that caught fire last year and the industry's eased shortage situation, according to DRAMeXchange, a research division of TrendForce. If DRAM makers do not cut memory production, …

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Crucial to offer 3GHz DDR4 memory modules later this year

Sometimes in the third quarter of this year Intel Corp. plans to release its next-generation high-end desktop (HEDT) platform code-named “Lituya Bay” based on the code-named “Haswell-E” central processing units that will rely on DDR4 memory to maximize bandwidth. For those, who will want to get some extra performance out …

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Samsung and SK Hynix Unveil Next-Gen LPDDR4 Memory

Samsung Electronics and SK Hynix, two leading manufacturers of dynamic random access memory (DRAM), this week introduced next-generation LPDDR4 memory for mobile devices. The two companies have already shipped samples of the new mobile DRAM to leading designers of mobile system-on-chip (SoC) solutions. Samsung’s and SK Hynix’s first LPDDR4 chips …

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Kingston HyperX Predator 2800MHz 8GB Memory Kit Review

It's Kingston's turn to take shot at the ultra-high frequency memory market. Can the 2800MHz HyperX Predator kit grab the attention of enthusiast benchmarkers and extreme overclockers? With the vast improvements in memory frequency support brought about by Haswell's powerful IMC, manufacturers took the opportunity to release ultra-high frequency memory …

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G.Skill announces new 8GB 2133MHz CL11 SO-DIMM kit

G.Skill is looking to push the current envelope as much as possible with the unveiling of its latest Ripjaws kit designed with laptops in mind. That's right, this new high performance DDR3 kit with an 8GB capacity (2 x 4GB) is a matched pair of SO-DIMM, featuring a bandwidth of …

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GSkill most popular memory for HWBot overclockers

If you're an overclocker, enthusiast or system builder and you're also part of the HWBot community, chances are you use GSkill memory. That won't apply to everyone of course, but the memory manufacturer has just announced that out of all the brands in use around the world, its one is …

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