Memory

Development of DDR4 dynamic random access memory took a long time. However, adoption of the new DRAM will be rather quick. Already next year the majority of servers and personal computers will rely on DDR4. The DDR4 memory standard is currently supported by Intel Corp.’s server platforms as well as …

G.Skill this week is demonstrating its upcoming DDR4 dual-channel memory kits that can run at clock-rates higher than 4GHz at the Intel Developer Forum. The company intends to start selling such products in the coming months or weeks. G.Skill is working on Trident Z-series 8GB dual-channel DDR4 memory kits that …

The 5GHz frequency milestone for computer memory is yet to be achieved, but professional overclockers are probably not far from hitting it. This week Chi-Kui Lam, a well-known computer tweaker, managed to push a DDR4 memory module from G.Skill to whopping 4.90GHz. Chi-Kui Lam overclocked a 4GB G.Skill Ripjaws 4 …

It was a matter of time before off-the-shelf DDR4 memory managed to hit 4000MHz milestone. At present, only G.Skill offers 4GHz memory modules commercially, but other makers are gearing up to release their kits with unprecedented clock-rate. Corsair is showcasing such modules at the Intel Developer Forum. At the IDF, …

Throughout its history, Rambus has received royalties from other makers of chips for its patents. However, on Monday the company introduced its own ICs designed to improve server-class memory modules. The company will sell the products to interested parties itself. The first in a family of R+ chips, the RB26 …

A professional overclocker this week set a new clock-rate record for DDR4 memory. This time a memory module from G.Skill was overclocked to whopping 4838MHz on Gigabyte Technology’s Z170X-SOC Force mainboard. Hicookie, a professional overclocker from Taiwan who works with Gigabyte Technology, this week pushed a 4GB G.Skill memory module …

Samsung Electronics has introduced its all-new solid-state drives based on the latest TLC 3D V-NAND flash memory for enterprises. The SSDs provide unprecedented levels of performance, capacity, endurance and reliability, which will help Samsung to address new markets. The new enterprise-class SSDs are based on Samsung’s latest 48-layer 3D V-NAND …

Samsung Electronics on Tuesday said that it had started to mass produce the world’s first triple-level-cell (TLC) three dimensional vertical NAND flash memory chips with 256Gb capacity. The new 3D V-NAND memory ICs [integrated circuits] will help Samsung to make solid-state drives and other flash-based devices more affordable, which will …

Toshiba Corp. on Thursday introduced the world’s first NAND flash memory packages, which stack eight or 16 dies of NAND flash memory devices and feature 128GB or 256GB capacities. The NAND flash memory chips are designed for various applications that require high density of NAND flash storage, including mobile products …

Although Intel Corp.’s latest “Skylake” microprocessors officially support only DDR4 and DDR3L memory technologies, Asustek Computer claims that its Intel Z170-based motherboards with 240-pin DIMM slots will work with standard DDR3 memory modules with industry-standard voltages. DDR4 SDRAM memory has default voltage of 1.2V, but memory modules for overclockers with …

The new Intel Corp.’s Core i7-6700K “Skylake” processors have clearly helped professional overclockers to set new DDR4 frequency records. G.Skill on Thursday said that one of its Ripjaws 4 memory modules managed to hit nearly 4.8GHz clock-rate earlier this week. Chi-Kui Lam, a world-class overclocker from Hong Kong-based HKEPC, successfully …

Nowadays virtually all makers of mainboards offer motherboards with various exotic colours, including white or even silver. Makers of memory modules have traditionally been more conservative and typically such products come with black heat spreaders and PCBs. However, Crucial, a division of Micron, decided to release something for modders, who …

Toshiba Corp. and SanDisk Corp. have formally introduced their first vertically stacked triple-level-cell (TLC) NAND flash memory IC [integrated circuit] with 256Gb capacity. The new 3D BiCS [bit cost scalable] NAND flash memory will be mass produced next year. Toshiba’s new 256Gb (32GB) 48-layer BiCS flash device features 3-bit-per-cell TLC (triple-level cell) …

Samsung Electronics has reportedly decided to reduce production of standard dynamic random access memory (DRAM), which could cause increase of DRAM prices in the coming months. The world’s No. 1 maker of computer memory will increase production of LPDDR in a bid to supply enough memory to Apple, which is …

In a bid not to create oversupply of NAND flash memory in the market, SanDisk Corp. will continue to cautiously expand its manufacturing capacities to sustain its profit margins. While even a minimal expansion of wafer capacities will be enough for SanDisk to fulfill demand for its products, it remains …

SanDisk Corp. and Toshiba Corp. are on-track to start volume shipments of products based on their BiCS [bit cost scalable] 3D NAND flash memory in 2016. Recently the two companies began to purchase equipment needed to manufacture vertically stacked NAND chips and will initiate pilot production later in 2015. Moreover, …

G.Skill International Enterprise Co., one of the globe’s leading makers of high-end memory modules, on Wednesday introduced its all-new Trident Z and Ripjaws V families of DDR4 memory modules designed for enthusiast-class systems running the latest microprocessors from Intel Corp. The most advanced Trident Z and Ripjaws V modules are …

With DDR4 prices being driven down in preparation for the launch of a mainstream chipset supporting the memory type, now can be considered a good time to bag a high density quad-channel kit. Combining a quartet of 8GB DIMMs in a quad-channel configuration with an operating frequency of 2400MHz and …

Intel Corp. and Micron Technology on Tuesday introduced a brand new type of memory called 3DXPoint. The new memory technology combines advantages of DRAM and NAND flash and is expected to enable storage solutions with performance that is orders or magnitude higher than today. 3D XPoint will be exclusively manufactured …

Rambus this week said that it will officially introduce its all-new datacenter-class dynamic random access memory (DRAM) architecture in the coming weeks. The new DRAM is expected to shrink latencies and increase capacities of computer memory chips, something that is tremendously important for servers working with big data and in-memory …

Tsinghua Unigroup last week communicated its interest to acquire Micron Technology to the company, but did not present a formal offer. Moreover, according to sources close to the producer of DRAM and flash, the U.S. authorities would block the deal because Micron is strategically important for the country. China-based Tsinghua …

Financial analysts believe that the rumoured takeover of Micron Technology by China-based Tsinghua Unigroup could lead to a major change of Micron’s policies in regards of expansion of production capacities. If Tsinghua acquires Micron and starts to build new fabs to gain market share, this could result in oversupply of …

Tsinghua Unigroup, a China-based investment company that controls Spreadtrum Communications and RDA Microelectronics, reportedly wants to acquire Micron Technology, the world’s third largest maker of DRAM and the No. 4 maker of NAND flash. China may need Micron in a bid to boost its homegrown memory industry and secure supply …

Despite of the fact that personal computer makers are now buying dynamic random access memory in a bid to support demand during the back-to-school season, DRAM prices continue to drop. Not only weak demand impacts DRAM prices negatively. All memory makers are transiting to thinner manufacturing technologies and Samsung even …

The year 2014 was very favourable for producers of dynamic random access memory as well as for makers of various DRAM modules thanks to rather high prices and stable demand for personal computers and other devices. Kingston Technology remained the top producer of memory modules on the planet with nearly …

Micron Technology, the world’s third largest maker of computer memory, plans to close its process technology gap with market leader Samsung Electronics with its next-generation fabrication technology in the coming years. The firm hopes that its new manufacturing process will help it to lower costs and increase performance of its …

Micron Technology has announced that it had begun commercial shipments of GDDR5 chips made using 20nm process technology. The company did not reveal any details, but it is highly likely that Micron initiated shipments of its 8Gb GDDR5 chips several weeks ago. “We commenced shipments of our first 20 nanometer …

Micron Technology has been rather cautious about using triple-level-cell (TLC) NAND flash in solid-state drives and for a long time only used such memory for various removable storage applications. However, it appears that the company has finally solved all the challenges with such cheap NAND and plans to introduce an …

DDR4 memory is yet to become mainstream DRAM technology, but Samsung Electronics is reportedly reducing prices of its DDR4 chips in a bid to gain market share. Samsung’s actions may trigger further drops of memory pricing in the future. At present DDR4 memory is used only by high-end desktop as …

G.Skill this week announced that an overclocker has managed to push its 4GB DDR4 memory module to 4.43GHz, a new world record for this memory type. The overclocker used current-generation high-end desktop platform, so it is possible to expect that later this year this record will be beaten. Nick Shih, …